The IEC 60601-1 medical standard has gone through many revisions over the past 40 years since its inception and keeping track of those changes is not always easy. In this blog post contributed by CUI and published on Power Systems Design, we take a look at the new IEC 4th edition standard, how it relates to power supplies, and how to be prepared for the coming transition.

In this article published by Electronic Products, Bruce Rose, CUI’s Applications Engineer, discusses some of the common pitfalls of leaving EMC emissions testing until the end of a project and how considering EMC emissions earlier in a design through pre-compliance testing can save engineers valuable time and money, while keeping their project on track.

Determining the type and size of a cooling fan needed for your design is not always easy. In this blog post published by Electronic Design, Jeff Smoot, CUI’s VP of Application Engineering and Motion Control, lists five simple steps to help aid the process of selecting the appropriate fan for your application.

In the May 2017 EDN Power Forward blog post, Mark Adams, CUI’s Senior VP, highlights the impending availability of 5G network technology, the resulting strain that 5G data will put on data center power infrastructure, and the Software Defined Power® solution being developed to solve those challenges.

In this article published by Electronic Design, Mark Adams, CUI’s Senior VP, looks at the rapidly accelerating demand for cloud computing and data usage in the age of IoT and how companies like CUI and VPS are combining software and hardware to lessen the strain being put on data center power capacity.

In a follow up to a previous article, CUI’s VP of Application Engineering and Motion Control, Jeff Smoot, takes a second look at MTBF (mean time between failures) and what it means for products composed of multiple components in this blog post published on EDN Europe.

In the October 2016 EDN Power Forward blog post, Jeff Schnabel, CUI’s VP of Global Marketing, outlines the constantly changing landscape surrounding the efficiency standards for external power supplies and what it means for OEMs.

In this article posted on Motion Control Tips, a Design World resource, Jeff Smoot, CUI’s VP of Application Engineering and Motion Control, takes a look at the three most common encoder technologies and explains how capacitive technology blends the necessary accuracy and ruggedness needed to perform under severe industrial conditions.

In the September 2016 edition of Bodo’s Power Systems, CUI’s Senior Vice President, Mark Adams, discusses power capacity challenges in datacenter infrastructures and how CUI’s partnership with Virtual Power Systems (VPS) is taking a hardware and software approach to solve those inefficiencies. Included with the article is a full-page front cover designed by CUI’s Marketing team.

This blog post originally published by Ismosys discusses the miniaturization of consumer electronics and the challenges this trend places on design engineers, including finding manufacturers of component-level solutions that match the design requirements of smaller applications.

In the May 2016 EDN Power Forward blog post, Mark Adams, CUI’s Senior VP recaps the Applied Power Electronics Conference (APEC) 2016 held in Long Beach, CA. In the post Adams highlights the show’s continued focus on hardware development, but also notes the overall lack of software which he views as the next step in power supply design.

In this article published by EDN, Jeff Smoot, CUI’s VP of Application Engineering and Motion Control, discusses the common misconceptions that occur when talking about reliability and mean time between failures (MTBF) of various products and components.

In this article published by Electronics Weekly, CUI’s VP of Global Marketing, Jeff Schnabel, discusses the role Level VI efficiency standards will play in energy savings as the Internet of Things (IoT) boom continues to rise.

With the coming Level VI standards just around the corner, CUI’s VP of Global Marketing, Jeff Schnabel, provides a guide for OEM’s trying to navigate the more stringent regulations in an article posted on Power Electronic Tips an EE World resource.

In the December 2015 EDN Power Forward blog post, Mark Adams, Senior VP at CUI continues the discussion on the coming Level VI regulations and government’s role in energy efficiency savings.

In this article published by Electronic Products, Jeff Schnabel, CUI's VP of Global Marketing, outlines the new Level VI efficiency regulations set to go into effect in February 2016. The article also highlights the implications the new law will have on any OEMs designing products with external ac-dc adapters for the US market.

In the May 2015 EDN Power Forward blog post, Mark Adams, Senior Vice President at CUI, discusses the impact that the coming DOE Level VI regulations have on power supply design and how CUI is leading the way on Level VI to keep its customers ahead of the new regulations.

In the e-Drive article “Intelligence Comes to the Commutation Encoder” CUI’s VP of Motion Control, Jeff Smoot, examines common encoder technologies and highlights why capacitive encoding is the superior choice.

Lee Teschler of Design World discusses the upcoming Level VI regulations including quotes from CUI's Product Manager of External Adapters, Andrew Johnson.

Miles Budimir, Editorial Director for Design World, sits down with several leading encoder manufacturers, including CUI's VP of Motion Control, Jeff Smoot, to discuss the top encoder trends for 2015 in an article posted on Motion Control Tips, a Design World resource.

In this article published by EDN, Editor, Steve Taranovich, discusses the upcoming Level VI efficiency standards and how CUI is working to implement the new standards across its power portfolio to keep its customers ahead of the continuously evolving global regulations.

CUI's VP of Motion Control, Jeff Smoot, discusses brushless dc motors and how capacitive commutation can speed up the time consuming assembly process. The article was published on Motion Control Tips, a Design World resource.

In this article published by EE Times, Editor, Rich Quinnell, discusses rotary encoders and how CUI's AMT encoders are bringing intelligence to the motion control market.

In the January 2015 EDN Power Forward blog post, CUI Senior Vice President, Mark Adams, discusses the significance of the Internet of Things (IoT) and its overall impact on energy efficiency and power consumption.

CUI's Power Applications Engineer, Arun Ananthampalayam, continues the "Back to Basics" series, published by EE Times, with an article focusing on reliability considerations in power supplies.

This article written by CUI’s VP of Marketing Jeff Schnabel, and published in Electronic Products, explains what IEC 60601-1 3rd edition is and how it will affect the way power is implemented in a device.

In the EE Times article "The 13-Step EMI Mitigation Program for Switching Power Supplies" CUI's VP of Marketing, Jeff Schnabel, examines 13 key steps that can help eliminate the issue of EMI.

The next article in CUI’s “Back to Basics” series focuses on power factor correction. Published on EE Times’ website the article begins, “The advent of the switching power supply has made it possible...

 The article “Back-to-Basics: On Power Factor and Why We Correct It” examines the topic of power factor by examining what it is and its implications, as well as discussing power factor correction.

Earlier this year the US followed the EU and Canada in moving to the 3rd edition of the IEC 60601-1 medical device standard. This change presents several challenges and adds layers of complexity for medical device designers. The article “Understanding the Impact of 60601 3rd Edition on Power Design” examines the changes and their effect on implementing power supplies in medical devices.

CUI and EE Times have teamed up to bring you a new article series called "Back to Basics". The first entry titled "Back to Basics: Thermal Management for Power Supplies" written by CUI's Power Marketing Applications Engineer, Arun Ananthampalayam, begins, "One of the most important considerations in the design and selection of a power supply is its thermal management, says Arun Ananthampalayam of CUI. Here we examine the pathways for heat transfer and how power supply designs have evolved to enable effective heat dissipation and deliver greater performance."

CUI's Vice President of Global Marketing, Jeff Schnabel, addresses the ever-changing regulations for external power supplies in a recent EEbeat post. The article explains past and current mandatory efficiency levels for external power supplies, and takes a look at what the future holds.

CUI's Technical Marketing Manager, Bruce Rose, answered the question "What is the power source of the future? Will it change as dramatically as some predict?" for ECN magazine's August Brainstorm. Bruce takes a high level approach in his answer considering economic, political, environmental and technological factors.

The article "Understanding Efficiency Standards for External Power Supplies" written by CUI's VP of Marketing, Jeff Schnabel, has been published on the Electronic Design website as part of their Engineering Essentials section. Topics covered in the article include a chronology of external power supply regulations, the current regulatory environment, exemptions, and what the future holds

CUI's VP of Global Marketing, Jeff Schnabel, participated in Wireless Design & Development's March/April issue Brainstorm discussion. The question posed was "How are you responding to the demand for low power/high efficiency devices in the emerging markets?"

CUI's AMT203 was featured in the recent Design World article, "Taking the Pulse of the Encoder World". The article covers the latest developments and technology in the encoder world. It appeared in the December issue of Design World and online.

An article written by CUI titled "Electromagnetic Compatibility Considerations for Switched Mode Power Supplies" was published in the October issue of Bodo's Power Systems. The article examines the rules and regulations governing control of EMI, discusses types of noise generated by SMPS, and provides basic guidance for EMI mitigation for SMPS, whether installed in other equipment as part of a larger system or a SMPS designed for stand-alone applications.

Machine Design looked into the capacitive technology that makes CUI's AMT encoder unique. The article, written by Editor Leland Teschler begins, "The quest for energy-efficient designs has made capacitive position encoders a hot topic."