Introducing the arcTEC™ Structure
To combat the effects of thermal fatigue, CUI has implemented an advanced construction technique called arcTEC™ structure, which allows for higher performance and reliability when compared to conventional thermoelectric module designs.
Key Technology Benefits
- Thermal Resin: Thermally conductive resin allows for repeated thermal expansion and contraction, resulting in: better thermal connection, superior mechanical bond, and no marked drop-off in performance over time.
- Improved Solder: High temperature SbSn solder carries a 235°C melting point, offering superior resistance to thermal fatigue and better shear strength when compared to the 138°C melting point of typical BiSn solder.
- Larger Semiconductors: Larger P/N elements made from premium silicon ingot are as much as 2.7 times larger than other P/N elements on the market, leading to faster, more uniform cooling.
Improved Reliability with arcTEC Structure
The combined effect of the thermally conductive resin and the SbSn solder joints within the arcTEC structure has a dramatic effect on the reliability and life span of the Peltier modules.
The data shows the stark contrast between Peltier modules built with and without the arcTEC structure. After as few as 3000 thermal cycles, the conventional Peltier modules already show a dramatic change in resistance. In contrast, the modules built using the arcTEC structure show negligible change in resistance all the way out to 30,000+ thermal cycles.
Improved Thermal Performance
In addition to superior reliability and module longevity, modules built with the arcTEC structure also offer enhanced thermal performance, thanks to its larger P/N elements mentioned earlier.
IR inspection shows an even temperature distribution across the surface of the ceramic substrate for units built with the arcTEC structure. Conventional units, in contrast, exhibit multiple temperature variations, indicating diminished cooling performance and higher risk of a shorter working life. These temperature variations can result from inferior P/N element quality, smaller element size, or poor solder quality within the module.
In field testing, modules utilizing the arcTEC structure demonstrated a greater than 50% improvement in cooling time compared to competing modules. This dramatic difference can be attributed to both the size and quality of the P/N elements as well as to the improved reliability the arcTEC structure provides.